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| Article Name : | | | INCREASING RELIABILITY OF PROCESSOR BY OPTIMUM UTILIZATION OF THERMIONIC SINK | | Author Name : | | | S. Srinivasa Ravi Sankar , Ch.Venkata Rajesh | | Publisher : | | | Ashok Yakkaldevi | | Article Series No. : | | | GRT-4331 | | Article URL : | |  | Author Profile View PDF In browser | | Abstract : | | | The heat pipe is widely used because of its amazing heat transfer rate. Since last decade heat pipes became more popular because of its wide applications in cooling systems. Manufacturers like Asia Vital Components now have their own heat pipe manufacturing facilities, and heat pipe manufacturing is no longer reserved to a few specialized companies The thermal resistance of materials is of great interest to electronic engineers, because most electrical components generate heat and need to be cooled. Some electronic components malfunction when they overheat, while others are permanently damaged. The project aims at thermal heat sink of Computer Processing Unit (CPU) which is particularly useful in energy-conservation equipment where it is desired to recover heat from hot gases for air-preheater or supplemental heating applications. In some cases the heat-pipe can take the place of more costly combinations of pumps, piping and dual heat-exchange configurations, further in this regard, design and theory is vital. In many cases, engineers follow a thermal analysis with a stress analysis to calculate thermal stresses (that is, stresses caused by thermal expansions or contractions). | | Keywords : | | |
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